LED Chip Design

Main post-grown technological processes that forms Mid IR LED chips are presented below:
  1. Decreasing the wafer thickness to 200 µm
  2. Deposition of the full area contact multilayer system Cr/(Au+Te)/Ni/Au to n-type semiconductor
  3. Photolithography for the circular or ring top contacts
  4. Deposition of the top contact multilayer system Cr/(Au+Zn)/Ni/Au to p-type semiconductor
  5. Lift-off removing of the photoresist
  6. Photolithography for LED chip forming
  7. Etching of separation channels
  8. Cutting LED chips
Standard Mid Infrared LED chip

Company contact: Nikolay Stoyanov e-mail ns@iropt6.ioffe.ru